gnb ?? ???? ?? ????

Package Substrate

??? ?? ??

???? PC? ?? ???? ???? Package ????, ???? ???? ? ??? ?? ?? ?? ? ??? ???? ?? ??????? ????? ??? ???. ?? ?? ?? ?? ? ??? ??? ???? ?? ??? ?? ????, ??? ???? ?? ?? ??? ???? ? ? ???? ?? ??? ??? ?? ? ????.

FCCSP(Flip Chip Chip Scale Package)

???? ??? ??? ?? ??? ?? ??? ?? ???? ?? ??? ???? ??? FCCSP(Flip Chip Chip Scale Package)?? ???. ?? ??? IT ??? AP(Application Processor) ???? ?????. ?? Gold wire? ???? WBCSP ? ??? ??? ??? ?? ??? ??, ?? ?? Input / Output? ??? ? ?? ??? ???? ?? ?????.

????
??? ?????? ????, Baseband ?
FCCSP(Flip Chip Chip Scale Package) ??. [1.??? Chip? Solder? Bumping. 2.??? ???? ???(Flip) 3.??? ???? PCB??? Packing]

??????

1. Bumping ???
FCCSP? Bumping ??(??? Bumping)?? ?? Solder Ball
2. μBall Bump ??
 μBall Bump ???? Metal Mask? Solder Paste? ????(Squeegee)? ?? ????? Conventional ??? Metal Mask ??? ?? Solder Ball? ????? Micro Ball??.
  • · Available for Fine Bump Pitch
  • · Good for Small Bump Risk
  • · Good Quality for Bump Characteristics

?? ??

1. EPS(Embedded Passive Substrate) & EDS(Embedded Die Substrate)

EPS/EDS? ??? ????, IC ?? ?? ??? ???? ??? ??? ?????. Decoupling Capacitor? ?? Power Supply Voltage Level? ?????? ?????. IC? ?? ??? ???? ??? ?? ?? ? ??? ?? ? ????.

EPS, EDS ??
2. ETS(Embedded Trace Substrate)

ETS? ?? ??? ??? ?? ???? ??? ?? ?????. ??? Coreless ??? Cost ?? ?? ???? ??? ???? ??? ?? ??? ??(4L → 3L) ???.
?? ?? ??? ?? ?? ??? ?? ????, ?? ?? ???? ??? ? ????.

ETS ??? ????? ?? ?? ??. [2Layer Buried Trace, 3Layer Buried Trace, 4Layer Buried Trace]

Lineup

Lineup by Specification
Mass Production Sample Available
Lineup by Specification - Routing Density, Low Z-Height? ?? ??? ?????.
Routing Density Build-Up Line Width / Space 8 / 10um 7 / 9um
BVH / Pad Registration 50 / 80um 45 / 75um
SRO Diameter SR Registration 55 ± 8um 50 ± 8um
FC Bump Pitch (Peripheral) 35um 30um
FC Bump Pitch (Area) 125um 125um
Low Z-Height Core / PPG Thickness 40 / 18um 35 / 15um
SR Thickness 8 ± 3um 7 ± 2um

WBCSP(Wire Bonding Chip Scale Package)

Gold Wire? ??? ?? ??? ??? ????, ??? Chip ??? ?? ??? 80% ?? ??? ????? WBCSP?? ???. Chip? PCB ? ??? Gold Wire? ????, ?? ???? ???? ??? Chip? ?? ?????. ??, UTCSP(Ultra Thin CSP) ??? 0.13㎜ ??? ??? ??? ??? ? ?? Chip to PCB Connection ? ???? ??? Multi Chip Packaging ???? ?? ??? Package ?? ???? ??? ? ????.

????
???? ??? ?
WBCSP(Wire Bonding Chip Scale Package) ??? ????[1. Mold, 2.Tape Substrate, 3.Gold Wire, 4.Solder Ball, 5.Copper Trace], Gold Wire? ??? ??? ??.

Lineup

Lineup by Specification
General WBCSP Road Map of HVM / Sample Product Mass Production Sample Available
Lineup by Specification - Routing Density, Low Z-Height? ?? ??? ?????.
Routing Density Bond Finger Pitch 65P (37 / 15, Ni 2) 60P (32 / 15, Ni 2)
Line Width / Space 50 Pitch 40 Pitch
SRO Diameter Tolerance ± 15um ± 10um
Ball SR Registration
(After Compensation)
± 17.5um ± 16um
Low Z-Height Core/PPG
Thickness
2Layer 80um 80um
3Layer 80um 80um
4Layer 120um 120um
Lineup by Structure
Mass Production Sample Available
Lineup by Structure - Core, Layer Count, Pattern, Structure? ?? ??? ?????.
Core Layer Count Pattern Structure
Cored 2Layer Normal
Cored 4Layer Normal
Coreless 3Layer Normal
Coreless 4Layer Normal

SiP(System in Package)

Package ?? ?? ?? IC? Passive Component? ?? ?? ???? ??? ??? System?? ???? ?????. ?? PA(Power Amplifier)? ?? ??? ????, ?? ??? ??? ????. ?? ????? Flip-Chip SiP? Coreless? ????.

????
PA(Power Amplifier), PAMID (Power Amplifier Module with Integrated Duplexer), FEMID(Front-End Module with Integrated Duplexer), SAW Filter, BAW Filter,
Diversity FEM, Switch ? ?? RF??

??

1. ???

?? ?? IC ? ????? ??? Module? ???? Package ??? ??? ?????.

SiP ?? ????. [1.SiP, 2.Die1, 3.Die2, 4.Die3]

2. ?? ?? ??

? ?? ??? ??? 0.2mm ?? ??(6? ??) ??? ?????.

SiP? ??? ?? ?? ??? ???? ?? ???? ??? ???. [0.2T 6L RF-SiP(200um), 0.27T 8L RF-SiP(270um), 10L ~, 5G ??? ??]

??????

1. Coreless RF-SiP

Coreless ???? ?? ??? ??? EMI(Electro Magnetic Interference) ? Parasitic Inductance? ???? ?? ??? ???? ? ???, ?? ???? Thin Substrate? ??? ? ????.

Coreless ??? ??? ????? ??  Coreless ??? Cored ??? ??? ??. [Cored ??(45um core), Coreless ??(20um dielectric) *Thin substrate ?? ??]
2. ENEPIG ?? ??

ENEPIG ?? ?? ??? ??? ?? ??? ??? ????.

  • 1) Thin Ni ENEPIG

    - Bonding Pad? Ni ??? ???? RF ??? ??

    ENIG/ENEPIG(Gold, Nickel, Copper, Palladium) ? Thin Ni ENEPIG(Gold, Nickel, Palladium, Copper) ?? ?? ??. [ENIG/ENEPIG(Ni ??: 5~6.5um) , Thin Ni ENEPIG(Ni ??: 0.1um)]
    * ENIG : Electroless Nickel Immersion Gold
    * ENEPIG : Electroless Nickel Electroless Palladium Immersion Gold
  • 2) Selective ENEPIG

    - ???? ?? ????? ??(ENEPIG + OSP)

    ENEPIG? OSP? ???? ????? ??(ENEPIG+OSP)
    * OSP : Organic Solderability Preservative

Lineup

Lineup by Specification
Mass Production Sample Available
Lineup by Specification - Layer Structure, Line Width / Space, Bump Pitch, Cu Thickness, Surface Finish? ?? ??? ?????.
Layer Structure Cored 4L / 6L / 8L 4L / 6L / 8L
Coreless 5L / 7L 6L / 8L / 9L
Line Width / Space 25 / 25 um 20 / 30 um
Bump Pitch 150 um 130 um
Cu Thickness 15 um 15 um
Surface Finish Direct Au, Thin ENEPIG Selective ENEPIG Direct Au, Thin ENEPIG Selective ENEPIG

FCBGA(Flip Chip Ball Grid Array)

??? ??? ?? ????? ???? ?? ??? ??? ?????. ??? ?? ??? ??? Flip Chip Bump? ????, ?? ? ?? ??? ???? ??? ??? ?????. ?? CPU ?? ??? ?????, ?? ?? ?? ? ?? ?? ??? ????, ??? ?? ???? ?? ?? ?? ?? ??? ?????.

????
PC, Server, TV, Set Top Box, Automotive, Game Console
???(17?~20?) FCBGA ?? ? ??, ?? ??. [17? : ??-10?(4-2-4), ??(Land to Pad)-14um, ??(Line/Space)-8/8um, 18? : 17?? ??, 19? : 18?? ??,  20? : ??-10?(4-2-4), ??(Land to Pad)-12.5um, ??(Line/Space)-8/8um]
* CPU 14nm : 8?, 14.5um LtP?? CPU 10nm : 10?, 14um LtP? ?? ?? ???? ?????.

Lineup

FCB? Standard Core, Thin Core ??? ????. Mass Production Sample Available

Lineup FCB Core Thickness(um), Line Width/Space Bump Pitch (Mass Volume) - ?? (4L, 6L, 8L, 10L, 12L, 14L, 16L)? ?? Standard Core, Thin Core ??? ?????.
Core Thickness (um) Line Width/Space
Bump Pitch
(Mass Volume)
 
4L 6L 8L 10L 12L 14L 16L
Standard Core 800 9 / 12 um
130 um
Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production
700 Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Sample Available
400 Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Sample Available
Thin Core 250 13 / 14 um
130 um
Mass Production Mass Production Mass Production Sample Available      
200   Mass Production Mass Production Sample Available      
100   Mass Production Sample Available        

*um? ?? ?????.

?? ??

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